Intel core i3 370m 2400 мгц

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Результаты тестов
SuperPI 1M 18.0
SuperPI 2M 42.0
SuperPI 32M 990.0
3DMark06 2578
Cinebench R11.5 CPU 2.0
Рейтинг 3Dmark06
158. Intel Core i5-430M 2584
159. AMD Phenom II X3 N850 2584
160. Intel Core i3-370M 2578
161. Intel Core 2 Extreme X9000 2549
162. Intel Core i7-2657M 2546
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Intel Core i3-370M — двухъядерный процессор среднего класса с тактовой частотой 2.4 ГГц, предназначенный для ноутбуков. В отличие от процессоров серий Core i5 и i7 не оснащается технологией разгона (TurboBoost) и функцией шифрования AES, а также функциями VT-d и Trusted Execution. Каждое ядро основано на микро-архитектуре Nehalem (Westemere). Технология Hyperthreading позволяет двухъядерному процессору использовать все 4 потока (для лучшей производительности программного конвейера).

Новый Core i3-370M оснащается интегрированной видеокартой GMA HD от Intel и контроллером памяти. Оба выполнены на отдельных кристаллах, но объединены на одной подложке. Графическое ядро производится по более старому 45 нм технологическому процессу, а кристалл процессора — по современному 32 нм процессу.

Производительность Core i3-370M должна быть примерно равной процессору Core 2 Duo с тактовой частотой 2.5 и 2.6 ГГц (высший класс процессоров в 2009 году). Такие показатели возможны, главным образом, благодаря эффективной функции многопоточности HyperThreading и встроенному контроллеру памяти. В однопоточных приложениях Core i3-370M работает c той же производительностью, что и процессор Core 2 Duo с аналогичной частотой.

Встроенная графическая карта Intel Graphics Media Accelerator HD (GMA HD) работает на частоте до 500-667 МГц (в режиме Turbo Boost), поэтому значительно производительнее, чем более старая GMA 4500MHD. Впрочем, процессоры серий Core i5 и i7 чуть быстрее, благодаря более высокой максимальной тактовой частоте графического ядра. Производительность графики в 3D примерно сопоставима с картой Radeon HD 4200, но драйвера у нее оптимизированы не достаточно.

Максимальное силовое потребление достигает 35 Вт (TDP), и характеризует энергопотребление всего чипа (процессора, графического ядра и контроллера памяти), что в свою очередь, заметно лучше, чем те же 35 Вт TDP у серии Core 2 Duo T только для процессора.

Описание

Intel начала продажи Intel Core i3-370M 10 января 2010 по рекомендованной цене 245$. Это ноутбучный процессор на архитектуре Arrandale, в первую очередь рассчитанный на офисные системы. Он имеет 2 ядра и 4 потока и изготовлен по 32 нм техпроцессу, максимальная частота составляет 2.40 GHz, множитель заблокирован.

С точки зрения совместимости это процессор для сокета PGA988 с TDP 35 Вт. Он поддерживает память DDR3-800, DDR3-1066.

Он обеспечивает слабую производительность в тестах на уровне 4.25% от лидера, которым является AMD EPYC 7742.

Specifications

Compare Intel® Products

Essentials

  • Product Collection Legacy IntelВ® Coreв„ў Processors
  • Code Name Products formerly Arrandale
  • Vertical Segment Mobile
  • Processor Number i3-370M
  • Off Roadmap No
  • Status Discontinued
  • Launch Date Q3’10
  • Lithography 32 nm
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Performance

  • # of Cores 2
  • # of Threads 4
  • Processor Base Frequency 2.40 GHz
  • Cache 3 MB IntelВ® Smart Cache
  • Bus Speed 2.5 GT/s
  • TDP 35 W

Supplemental Information

  • Embedded Options Available No
  • Datasheet View now

Memory Specifications

  • Max Memory Size (dependent on memory type) 8 GB
  • Memory Types DDR3 800/1066
  • Max # of Memory Channels 2
  • Max Memory Bandwidth 17.1 GB/s
  • Physical Address Extensions 36-bit
  • ECC Memory Supported ‡ No

Processor Graphics

  • Processor Graphics ‡ IntelВ® HD Graphics for Previous Generation IntelВ® Processors
  • Graphics Base Frequency 500 MHz
  • Graphics Max Dynamic Frequency 667 MHz
  • IntelВ® Flexible Display Interface (IntelВ® FDI) Yes
  • IntelВ® Clear Video HD Technology Yes
  • IntelВ® Clear Video Technology Yes
  • Macrovision* License Required No
  • # of Displays Supported ‡ 2

Expansion Options

  • PCI Express Revision 2.0
  • PCI Express Configurations ‡ 1×16
  • Max # of PCI Express Lanes 16

Package Specifications

  • Sockets Supported PGA988
  • Max CPU Configuration 1
  • TJUNCTION 90В°C for rPGA, 105В°C for BGA
  • Package Size rPGA 37.5mmx 37.5mm, BGA 34mmx28mm
  • Processing Die Size 81 mm 2
  • # of Processing Die Transistors 382 million

Advanced Technologies

  • IntelВ® Turbo Boost Technology ‡ No
  • IntelВ® vProв„ў Platform Eligibility ‡ No
  • IntelВ® Hyper-Threading Technology ‡ Yes
  • IntelВ® Virtualization Technology (VT-x) ‡ Yes
  • IntelВ® Virtualization Technology for Directed I/O (VT-d) ‡ No
  • IntelВ® VT-x with Extended Page Tables (EPT) ‡ Yes
  • IntelВ® 64 ‡ Yes
  • Instruction Set 64-bit
  • Instruction Set Extensions IntelВ® SSE4.1, IntelВ® SSE4.2
  • Idle States Yes
  • Enhanced Intel SpeedStepВ® Technology Yes
  • Thermal Monitoring Technologies Yes
  • IntelВ® Fast Memory Access Yes
  • IntelВ® Flex Memory Access Yes

Security & Reliability

  • IntelВ® AES New Instructions No
  • IntelВ® Trusted Execution Technology ‡ No
  • Execute Disable Bit ‡ Yes

Ordering and Compliance

Retired and discontinued

IntelВ® Coreв„ў i3-370M Processor (3M cache, 2.40 GHz) FC-PGA10, Tray

  • MM# 908000
  • Spec Code SLBUK
  • Ordering Code CP80617004119AL
  • Shipping Media TRAY
  • Stepping K0

Trade compliance information

  • ECCN 3A991
  • CCATS NA
  • US HTS 8542310001

PCN/MDDS Information

SLBUK

  • 908000 PCN | MDDS

Downloads and Software

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor’s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. IntelВ® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

IntelВ® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandw >Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Processor Graphics ‡

Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. IntelВ® HD Graphics, Irisв„ў Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the IntelВ® Graphics Technology page for more information.

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Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

Graphics Max Dynamic Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using IntelВ® HD Graphics with Dynamic Frequency feature.

IntelВ® Flexible Display Interface (IntelВ® FDI)

The IntelВ® Flexible Display Interface is an innovative path for two independently controlled channels of integrated graphics to be displayed.

IntelВ® Clear V >IntelВ® Clear Video HD Technology, like its predecessor, IntelВ® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. IntelВ® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.

IntelВ® Clear V >IntelВ® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TJUNCTION

Junction Temperature is the maximum temperature allowed at the processor die.

Intel® Turbo Boost Technology ‡

IntelВ® Turbo Boost Technology dynamically increases the processor’s frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Platform Eligibility ‡

The Intel vProВ® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vProВ®

Intel® Hyper-Threading Technology ‡

IntelВ® Hyper-Threading Technology (IntelВ® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

IntelВ® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and ItaniumВ® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT) ‡

IntelВ® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in IntelВ® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64 ‡

IntelВ® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.В№ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

>Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStepВ® Technology

Enhanced Intel SpeedStepВ® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStepВ® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStepВ® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

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Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

IntelВ® Fast Memory Access

IntelВ® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

IntelВ® Flex Memory Access

IntelВ® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

IntelВ® AES New Instructions

IntelВ® AES New Instructions (IntelВ® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology ‡

IntelВ® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to IntelВ® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit ‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn’t provide direct warranty support. Contact your OEM or reseller for warranty support.

More support options for IntelВ® Coreв„ў i3-370M Processor (3M cache, 2.40 GHz)

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Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Processors that support 64-bit computing on IntelВ® architecture require an Intel 64 architecture-enabled BIOS.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with IntelВ® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

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